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IBM to Make Major Investment in NY

Governor David A. Paterson today announced significant new investments by IBM and New York State, accelerating New York State’s international leadership in nanotechnology research and development and creating up to 1,000 new high-tech jobs Upstate. The State will provide a total of $140 million in economic development grants, leveraging more than a ten-to-one private investment of $1.5 billion from IBM.

The investment will go toward three separate and complementary components of a comprehensive project, supporting the nanotechnology chip computer activities of IBM: the expansion of IBM’s operations at the College of Nanoscale Science and Engineering at the University at Albany (Albany NanoTech), the creation of a new, advanced semiconductor packaging research and development center at a to-be-determined in Upstate New York, and the upgrading of IBM’s East Fishkill facility in Dutchess County.

“With this announcement, we are once again demonstrating that New York State is open for business. We offer a highly skilled workforce and high quality of life. New York State is also, now more than ever, a clear national leader in nanotechnology development,” said Governor Paterson. “The positive effects of this critical investment will be felt for a generation, and will be the catalyst for other high tech business development throughout Upstate New York. Our State has become the leading location for nanotechnology research and development.”

The three projects will collectively advance “nano-chip” technologies, including cutting-edge chip design, demonstration, and testing which all takes place at Albany NanoTech. Nano-chips each carry billions of transistors, and applications include high-end personal computers and laptops; high-performance servers and supercomputers; virtual reality and advanced electronic games; medical devices and components; ultra-fast telecommunications devices; “sensor-on-a-chip” systems for anti-terrorism and “soldier-in-the-field” remote monitoring and sensing.

“This agreement demonstrates the potential of public-private academic collaboration. IBM applauds the bold leadership of Governor Paterson, Senator Bruno, Speaker Silver and other New York State leaders for their commitment to high-tech economic development,” said Dr. John E. Kelly III, IBM senior vice president and director of research. “These new investments will spur continuing advancements in nanotechnology and semiconductor research and development – including new efforts in semiconductor packaging – propelling IBM chip innovations and solidifying the state’s reputation as a high-technology leader.”

IBM has agreed to expand its operations at Albany NanoTech and the State will also provide $25 million to acquire state-of-the-art infrastructure and advanced semiconductor tooling at that location, resulting in the creation of 325 new research and development jobs.

To build on the successes at Albany NanoTech, the State will invest $50 million toward the establishment of a new, 120,000 square foot semiconductor packaging center at a to-be-determined location in Upstate New York. This center will be established, managed and owned by the College of Nanoscale Science and Engineering, with IBM conducting operations at that site. Rensselaer Polytechnic Institute (RPI) will also be a research partner in the new packaging facility. It is expected this public-private partnership will ultimately create over 675 jobs.

Today’s agreement will also help IBM retain more than 1,000 key semiconductor jobs at its East Fishkill plant in Dutchess County. The company has agreed to provide significant resources to upgrade that site with state-of-the-art technology. The State will additionally provide $65 million toward that effort.

IBM intends to extend its investments and semiconductor research and development partnership alliances to meet the increasing challenges of producing future semiconductor chips with 45-nanometer (one billionth of a meter), 32nm and smaller geometries, and to develop the required complementary advanced packaging technologies. Semiconductors have become increasingly sophisticated to meet growing demand for advanced computer systems, telecommunication devices and highly complex and multifunctional digital consumer electronic products.

(YWN Desk – NYC)

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